According to JEDEC solid-state technology association standards (specifically JESD220 series), the physical footprint of a typical UFS BGA 254 IC adheres to the following mechanical parameters: 254 active and mechanical balls.
rule) between differential pairs and nearby high-speed logic lines to mitigate crosstalk.
: The reference clock input (H1); must be pulled low or driven low by the host SoC when inactive. RESET_N : The hardware reset signal (H2). Handling and Safety Guidelines Ufs Bga 254 Datasheet
Generally utilizes lower voltages than eMMC. VCC: Core voltage for NAND flash operations.
If the BGA 254 datasheet specifies an MCP (e.g., uMCP), a vast majority of the remaining balls are dedicated to the high-speed LPDDR interface: Differential clock inputs for the DRAM. CA[5:0]: Command/Address inputs. DQ[31:0]: Data bus pins for 32-bit channel configurations. DMI[3:0]: Data Mask / Inversion signals. RESET_N : The hardware reset signal (H2)
Power supply for the controller core and low-voltage digital I/O (typically 1.1V to 1.3V).
Determines the data transfer capability. If the BGA 254 datasheet specifies an MCP (e
Supply voltage for the MIPI M-PHY interface blocks (typically 1.2V or 1.8V).
The term refers to a package that contains 254 solder balls arranged in an array under the memory die. This specific footprint is frequently used for "2-in-1" storage chips that integrate UFS memory and Low Power DDR (LPDDR) DRAM in a single multi-chip package (uMCP). Core Technical Specifications
Here's a summary of the key specifications of UFS BGA 254: